[mythtv-users] Lowest power HD frontend?

Gary Buhrmaster gary.buhrmaster at gmail.com
Tue Jun 4 04:08:14 UTC 2013


On Tue, Jun 4, 2013 at 3:43 AM, Raymond Wagner <raymond at wagnerrp.com> wrote:
....
> Once we finally start slowing, market pressures will just force chip
> manufacturers to go 3D to continue selling product, using vertical packing
> and inter-connectivity to work around timing issues from distances on large
> chips and allow ever increasing transistor counts.

Agreed.  Sun Microsystems R&D (before the Oracle acquisition)
had a number of 3D stacking demonstrator chips using proximity
communications, and IBM has been doing a fair amount of
through-silicon via (TSV) design work, with the Micron Hybrid
Memory Cube (HMC) a shipping product.


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