<html><body style="word-wrap: break-word; -webkit-nbsp-mode: space; -webkit-line-break: after-white-space; "><br><div><div>On Feb 29, 2008, at 11:00 AM, Josh White wrote:</div><br class="Apple-interchange-newline"><blockquote type="cite">Has anyone seen one of these in action?<br><br><a href="http://www.engadget.com/2008/02/29/msi-ecolution-motherboard-transforms-chip-heat-into-fan-power/">http://www.engadget.com/2008/02/29/msi-ecolution-motherboard-transforms-chip-heat-into-fan-power/</a><br></blockquote><br></div><div>No, but it's an interesting idea.</div><div><br class="webkit-block-placeholder"></div><div>I'd think that good case design would have sufficient airflow over and/or through a passive heatsink though. No-moving-part designs would be cheaper and more reliable.</div><div><br class="webkit-block-placeholder"></div><div>Probably more gimmick than solid engineering. </div><div><br class="webkit-block-placeholder"></div><div>beww</div><div><br class="webkit-block-placeholder"></div></body></html>